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Thick material processing - List of Manufacturers, Suppliers, Companies and Products

Thick material processing Product List

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Heavy processing

Near-net shape processing is possible! We can process various materials and shapes.

We would like to introduce our "thick material processing" using water jet technology. The quality of the processed surface is not affected by the thickness of the material, and since it is a processing method that does not generate machine load, distortion, or thermal effects, it results in a smooth cutting surface regardless of thickness. Due to the very narrow cutting width, nesting can be minimized, allowing for maximum utilization of materials without waste. 【Features】 ■ Increased productivity with high-speed and high-precision processing ■ Material savings and reduction of scrap ■ Since no vertical or horizontal forces are applied to the workpiece, simple clamping is sufficient ■ No thermal effects ■ Near-net shape processing is possible *For more details, please download the PDF or feel free to contact us.

  • Processing Contract

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Thick material processing of ceramic and glass substrates.

We have equipment such as cleaning devices and image dimension measuring instruments! We accept polishing processing of ceramics and other materials.

Our company applies the die-slicing processing technology we have cultivated over many years to offer cutting processing for thick products such as glass and ceramics. Using slicers and die cutters suitable for processing thick substrates, we can handle substrates with a maximum thickness of 24mm. By using materials like wax during cutting, we provide high processing accuracy and reliable quality. 【Slicing Processing】 ■ Compatible Work Sizes - Square Work: Up to 90mm (can be modified to accommodate up to 200mm) - Round Work: Up to 4 inches (can be modified to accommodate up to 8 inches) ■ Maximum Cutting Thickness: Up to 24mm (including the base material) *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Wafer processing/polishing equipment

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